Thermal Displacement Ventilation (TDV) Improves Efficiency and Classroom Environment - PIER TECHNICAL BRIEF
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Publication Number: CEC-500-2008-040-FS Abstract: Author(s): E-Source Commission Division: Technology Systems Division - R&D, PIER (500) Office/Program: PIER: Public Interest Energy Research PIER Program Area: Buildings End-Use Energy Efficiency Date Published: May 2008 Date On Line: 06/13/2008 Acrobat PDF File Size: 2 pages, 376 kilobytes |
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